Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614058 | Light emitting semiconductor device with a surface-mounted and flip-chip package structure | Ming-Der Lin | 2003-09-02 |
| 6603151 | Method and structure for packaging a high efficiency electro-optics device | Ming-Der Lin, Chang-Da Tsai, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang | 2003-08-05 |