Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6619531 | Temperature control method of solder bumps in reflow furnace, and reflow furnace | — | 2003-09-16 |
| 6619953 | Reflow furnace | Kouichi Shimizu | 2003-09-16 |
NY
Nobuyoshi Yamaoka
Overall (2003): #49,498 of 273,478Top 20%
2
Patents 2003