Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661082 | Flip chip substrate design | Honorio T. Granada, Jr., Connie Tangpuz | 2003-12-09 |
| 6633030 | Surface mountable optocoupler package | — | 2003-10-14 |
| 6627991 | High performance multi-chip flip package | — | 2003-09-30 |
| 6566749 | Semiconductor die package with improved thermal and electrical performance | Steven Sapp | 2003-05-20 |