Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6640423 | Apparatus and method for the placement and bonding of a die on a substrate | Edwin F. Johnson, Gerd R. Ley, Douglas Gene Lockie | 2003-11-04 |
| 6600384 | Impedance-compensating circuit | Mark J. Vaughan | 2003-07-29 |