Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667443 | Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method | Koji Kondo, Tetsuaki Kamiya, Toshikazu Harada, Ryuichi Onoda, Yasutaka Kamiya +2 more | 2003-12-23 |
| 6641898 | Printed wiring board and method of manufacturing a printed wiring board | Yoshitaro Yazaki, Yoshihiko Shiraishi, Koji Kondo, Toshikazu Harada | 2003-11-04 |
| 6527162 | Connecting method and connecting structure of printed circuit boards | Makoto Totani, Toshihiro Miyake, Takehito Teramae, Yoshitaro Yazaki, Kazuyuki Deguchi +1 more | 2003-03-04 |