JF

John A. Forthun

DM Dense-Pac Microsystems: 1 patents #1 of 2Top 50%
DT Dpac Technologies: 1 patents #4 of 6Top 70%
📍 Glendora, CA: #3 of 20 inventorsTop 15%
🗺 California: #4,287 of 28,521 inventorsTop 20%
Overall (2003): #60,369 of 273,478Top 25%
2
Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6660561 Method of assembling a stackable integrated circuit chip Mark G. Gordon 2003-12-09
6627984 Chip stack with differing chip package types Ted Bruce 2003-09-30