Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621710 | Modular probe card assembly | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2003-09-16 |
| 6605480 | Wafer level packaging for making flip-chips | Yuan-Ping Tseng, Y. Lee | 2003-08-12 |
| 6534853 | Semiconductor wafer designed to avoid probed marks while testing | Yuan-Ping Tseng | 2003-03-18 |