Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608382 | Metal bump | I-Ming Liu, Hong Chen | 2003-08-19 |
| 6556268 | Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB | Yu-Chi Lee, Hong-Yu Lin, Fang I. Shieh | 2003-04-29 |