Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6628001 | Integrated circuit die having alignment marks in the bond pad region and method of manufacturing same | Keelathur N. Vasudevan | 2003-09-30 |
| 6615195 | Method and system for evaluating technology transfer value | — | 2003-09-02 |
| 6556409 | Integrated circuit including ESD circuits for a multi-chip module and a method therefor | William T. Cochran, Yehuda Smooha | 2003-04-29 |
| 6552381 | Trench capacitors in SOI substrates | Charles Walter Pearce, Pradip K. Roy | 2003-04-22 |
| 6538283 | Silicon-on-insulator (SOI) semiconductor structure with additional trench including a conductive layer | Michael J. Kelly | 2003-03-25 |
| 6503793 | Method for concurrently forming an ESD protection device and a shallow trench isolation region | Yehuda Smooha | 2003-01-07 |