Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6577008 | Metal redistribution layer having solderable pads and wire bondable pads | Julius Kovats | 2003-06-10 |
| 6541284 | Integrated IC chip package for electronic image sensor die | — | 2003-04-01 |
| 6511901 | Metal redistribution layer having solderable pads and wire bondable pads | Julius Kovats | 2003-01-28 |