Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627976 | Leadframe for semiconductor package and mold for molding the same | Hyung Ju Lee, Jae Hak Yee | 2003-09-30 |
| 6555899 | Semiconductor package leadframe assembly and method of manufacture | Sung Sik Jang, Jae Hak Yee | 2003-04-29 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength | Sung Sik Jang, Jae Jin Lee, Tae Heon Lee, Hyung Ju Lee, Jung Woo Lee +3 more | 2003-02-25 |