Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639308 | Near chip size semiconductor package | Angel Orabuena Alvarez, Jun Yang | 2003-10-28 |
| 6630726 | Power semiconductor package with strap | William M. Anderson, Bradley D. Boland, Eelco Bergman | 2003-10-07 |
| 6605866 | Stackable semiconductor package and method for manufacturing same | Angel Orabuena Alvarez, Jun Yang | 2003-08-12 |
| 6521982 | Packaging high power integrated circuit devices | Blake A. Gillett, Bradley D. Boland | 2003-02-18 |