PH

Paul R. Hoffman

AT Amkor Technology: 6 patents #5 of 84Top 6%
📍 San Diego, CA: #30 of 1,748 inventorsTop 2%
🗺 California: #634 of 28,521 inventorsTop 3%
Overall (2003): #5,547 of 273,478Top 3%
6
Patents 2003

Issued Patents 2003

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
6632997 Personalized circuit module package and method for packaging circuit modules John Armando Miranda 2003-10-14
6630661 Sensor module with integrated discrete components mounted on a window 2003-10-07
6614102 Shielded semiconductor leadframe package Doug Mathews 2003-09-02
6603183 Quick sealing glass-lidded package 2003-08-05
6597059 Thermally enhanced chip scale lead on chip semiconductor package David McCann, Richard L. Groover 2003-07-22
6576998 Thin semiconductor package with semiconductor chip and electronic discrete device 2003-06-10