Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6538307 | Packaging substrate comprising staggered vias | Edwin Fontecha, Melissa Lee | 2003-03-25 |
| 6515354 | Micro-BGA beam lead connection with cantilevered beam leads | Edwin Fontecha, Valerie Vivares | 2003-02-04 |
| 6507100 | Cu-balanced substrate | Edwin Fontecha, Melissa Lee | 2003-01-14 |