SH

Steven H. C. Hsieh

AM AMD: 1 patents #457 of 1,053Top 45%
📍 Cupertino, CA: #282 of 688 inventorsTop 45%
🗺 California: #8,996 of 28,521 inventorsTop 35%
Overall (2003): #115,347 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6564986 Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board — 2003-05-20