MB

Mathias Boettcher

AM AMD: 1 patents #457 of 1,053Top 45%
📍 Dresden, DE: #34 of 146 inventorsTop 25%
Overall (2003): #168,943 of 273,478Top 65%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6639314 Solder bump structure and a method of forming the same Gisela Schammler, Frank Kuechenmeister 2003-10-28