Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649533 | Method and apparatus for forming an under bump metallurgy layer | — | 2003-11-18 |
| 6555396 | Method and apparatus for enhancing endpoint detection of a via etch | Ailian Zhao, Thomas E. Spikes, Jr. | 2003-04-29 |
| 6555479 | Method for forming openings for conductive interconnects | Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more | 2003-04-29 |
| 6514858 | Test structure for providing depth of polish feedback | Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more | 2003-02-04 |