Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6632690 | Method of fabricating reliable laminate flip-chip assembly | Raj N. Master, Diong Hing Ding | 2003-10-14 |
| 6538320 | Heat spreader having holes for rivet-like adhesive connections | Eric Tosaya | 2003-03-25 |