Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6581189 | Computer implemented method and program for automating flip-chip bump layout in integrated circuit package design | — | 2003-06-17 |
| 6569694 | Method of checking BGA substrate design | Pranabendra Sarma, Valerie Vivares | 2003-05-27 |