Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617241 | Method of thick film planarization | — | 2003-09-09 |
| 6534374 | Single damascene method for RF IC passive component integration in copper interconnect process | Eric A. Johnson, Chester Leung, Bo Yu, Yin Qian, Mark Hatzilambrou | 2003-03-18 |