TH

Tan Kim Hwee

AP Advanpack Solutions Pte: 1 patents #2 of 8Top 25%
📍 Singapore, SG: #183 of 665 inventorsTop 30%
Overall (2003): #110,628 of 273,478Top 45%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6510976 Method for forming a flip chip semiconductor package Romeo Emmanuel P. Alvarez 2003-01-28