KT

Kim Hwee Tan

AP Advanpack Solutions Pte: 1 patents #2 of 8Top 25%
📍 Singapore, SG: #183 of 665 inventorsTop 30%
Overall (2003): #177,827 of 273,478Top 70%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6550666 Method for forming a flip chip on leadframe semiconductor package Jimmy Chew 2003-04-22