Chew Tham Heang

AP Advanpack Solutions Pte: 1 patents #2 of 8Top 25%

📍 Singapore, SG: #183 of 665 inventorsTop 30%

Overall (2003): #250,221 of 273,478Top 95%

Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
6599775	Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor	Wang Tie, Miao Ping	2003-07-29