Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667191 | Chip scale integrated circuit package | Neil McLellan, Tak Sang Yeung, Onofre A. Rulloda, Jr. | 2003-12-23 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan | 2003-10-21 |