Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617020 | Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom | Jingjing Ma, James R. Peterson | 2003-09-09 |
| 6566234 | Semiconductor flip-chip package and method for the fabrication thereof | Miguel A. Capote, Xiaoqi Zhu, Ligui Zhou | 2003-05-20 |
| 6518677 | Semiconductor flip-chip package and method for the fabrication thereof | Miguel A. Capote, Xiaoqi Zhu, Ligui Zhou | 2003-02-11 |