Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486564 | Heat dissipation module for a BGA IC | Yi Pan, Kuo-Yuan Lee | 2002-11-26 |
| 6459162 | Encapsulated semiconductor die package | Yung-Chao Jen, Ming-Feng Wu | 2002-10-01 |
| 6380062 | Method of fabricating semiconductor package having metal peg leads and connected by trace lines | — | 2002-04-30 |