Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468834 | Method of fabricating a BGA package using PCB and tape in a die-up configuration | — | 2002-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468834 | Method of fabricating a BGA package using PCB and tape in a die-up configuration | — | 2002-10-22 |