Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442033 | Low-cost 3D flip-chip packaging technology for integrated power electronics modules | Xingsheng Liu | 2002-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6442033 | Low-cost 3D flip-chip packaging technology for integrated power electronics modules | Xingsheng Liu | 2002-08-27 |