Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486052 | Package having terminated plating layer and its manufacturing method | — | 2002-11-26 |
| 6339337 | Method for inspecting semiconductor chip bonding pads using infrared rays | Shuichi Matsuda, Keiichiro Kata, Masaharu Sato | 2002-01-15 |