BO

Burhan Ozmat

IA Intersil Americas: 1 patents #9 of 36Top 25%
GE: 1 patents #935 of 2,640Top 40%
TI Texas Instruments: 1 patents #308 of 1,023Top 35%
📍 Peekskill, NY: #4 of 44 inventorsTop 10%
🗺 New York: #821 of 9,277 inventorsTop 9%
Overall (2002): #32,082 of 266,432Top 15%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6476470 Integrated circuit packaging Robert K. Peterson 2002-11-05
6397450 Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein 2002-06-04
6377461 Power electronic module packaging Mustansir Kheraluwala, Eladio Clemente Delgado, Charles Steven Korman, Paul Alan McConnelee 2002-04-23