Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358831 | Method for forming a top interconnection level and bonding pads on an integrated circuit chip | Meng-Chang Liu | 2002-03-19 |
YL
Yuan-Lung Liu
Overall (2002): #83,674 of 266,432Top 35%
1
Patents 2002