TS

Tung-Liang Shao

AT Apack Technologies: 1 patents #1 of 3Top 35%
📍 Hsinchu, TN: #1 of 1 inventorsTop 100%
Overall (2002): #97,258 of 266,432Top 40%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6387795 Wafer-level packaging — 2002-05-14