Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358851 | Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue) | Chung-En Kao, Kuang-Hsing Liu, Ta-Bin Chen | 2002-03-19 |