CH

Chender Huang

TSMC: 1 patents #199 of 614Top 35%
📍 Boise, ID: #257 of 534 inventorsTop 50%
🗺 Idaho: #398 of 989 inventorsTop 45%
Overall (2002): #242,514 of 266,432Top 95%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6372619 Method for fabricating wafer level chip scale package with discrete package encapsulation Pei-Hwa Tsao 2002-04-16