Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455099 | Method and device for applying sealant to IC having bumps | Kouhei Enchi, Hiroyuki Yoshida | 2002-09-24 |
| 6370750 | Component affixing method and apparatus | Nobuya Matsumura, Shoji Sato, Akihiro Yamamoto, Yoichi Nakamura | 2002-04-16 |