Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440228 | Lead-free zinc-containing solder paste | Toshihiko Taguchi, Kunihito Takaura, Hisahiko Yoshida, Takashi Nagashima | 2002-08-27 |
| 6416590 | Solder powder and method for preparing the same and solder paste | Takashi Ohashi, Hisahiko Yoshida, Hiroji Noguchi, Takao Hisazumi, Mamoru Senna +1 more | 2002-07-09 |