Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6394161 | Adhesive applying apparatus | Nobuyuki Kakishima, Hitoshi Nakahira, Takayuki Mibuchi | 2002-05-28 |
| 6382497 | Reflow soldering apparatus and method | Nobuyasu Nagafuku, Masaya Matsumoto, Toshiyuki Koyama | 2002-05-07 |