Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383843 | Using removable spacers to ensure adequate bondline thickness | Kok Khoon Ho | 2002-05-07 |
| 6344161 | Device encapsulation process utilizing pre-cut slots in flexible film substrate | L. K. Suresh, Kanchit Suphanpeasat | 2002-02-05 |
| 6337225 | Method of making stacked die assemblies and modules | Donald Bottarini | 2002-01-08 |