Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451878 | High molecular weight epoxy resin and resinous composition for printed circuit board | Takao Fukuzawa, Tetsuro Imura, Yoshinobu Ohnuma | 2002-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451878 | High molecular weight epoxy resin and resinous composition for printed circuit board | Takao Fukuzawa, Tetsuro Imura, Yoshinobu Ohnuma | 2002-09-17 |