Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6410615 | Semiconductor sealing epoxy resin composition and semiconductor device using the same | Takashi Taniguchi, Tsutomu Nishioka, Tadaaki Harada, Toshitsugu Hosokawa, Kazuhiro Ikemura +2 more | 2002-06-25 |