Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448647 | BGA package substrate | Masahiro Fujimoto | 2002-09-10 |
| 6437251 | Flexible board made by joining two pieces through an adhesive film | Masanao Watanabe, Toshihiro Shinohara, Yukio Anzai, Mitsuhiro Fukuda | 2002-08-20 |
| 6420659 | Flexible wiring board pieces and wiring sheets | Akira Tsutsumi | 2002-07-16 |
| 6404052 | Multi-layer flexible printed wiring board | Masayuki Nakamura | 2002-06-11 |
| 6399891 | Multilayer boards | Masayuki Nakamura | 2002-06-04 |
| 6344308 | Method of manufacturing a flexible circuit board | Satoshi Takahashi, Akira Tsutsumi | 2002-02-05 |