Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465279 | Lead frame and production method thereof, and semiconductor device and fabrication method thereof | Kenji Ohsawa | 2002-10-15 |
| 6403402 | Semiconductor chip having an underplate metal layer | Kenji Ohsawa | 2002-06-11 |
| 6372620 | Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device | Kenji Oosawa, Tomoo Iijima | 2002-04-16 |
| 6369441 | Method of producing a semiconductor chip having an underplate metal layer | Kenji Ohsawa | 2002-04-09 |
| 6351025 | Semiconductor chip having an underplate metal layer | Kenji Ohsawa | 2002-02-26 |
| 6340840 | Lead frame and production method thereof, and semiconductor device and fabrication method thereof | Kenji Ohsawa | 2002-01-22 |