Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6380615 | Chip size stack package, memory module having the same, and method of fabricating the module | Sang Wook Park | 2002-04-30 |
| 6380629 | Wafer level stack package and method of fabricating the same | — | 2002-04-30 |