Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6359342 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Pao-Ho Yuan, Ting-Ke Chai, Jen-Yi Tsai | 2002-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6359342 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Pao-Ho Yuan, Ting-Ke Chai, Jen-Yi Tsai | 2002-03-19 |