Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441501 | Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep | Charles Tseng, Yu-Ting Lai, Chung-Pao Wang | 2002-08-27 |
| 6388313 | Multi-chip module | Ming-Hsun Lee | 2002-05-14 |