Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475832 | Open-cavity semiconductor die package | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura | 2002-11-05 |
| 6421254 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Dan Fuoco, Bill Ahearn | 2002-07-16 |