Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465886 | Semiconductor device having circuit pattern and lands thereon | Michio Horiuchi | 2002-10-15 |
| 6455786 | Wiring board and manufacturing method thereof and semiconductor device | Michio Horiuchi, Shigeru Mizuno, Takashi Kurihara | 2002-09-24 |
| 6444494 | Process of packaging a semiconductor device with reinforced film substrate | Takashi Kurihara | 2002-09-03 |
| 6420664 | Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate | Yoshihiko Ogawa, Norio Kojima | 2002-07-16 |
| 6404214 | Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device | Michio Horiuchi, Takuya Kazama | 2002-06-11 |
| 6335493 | Multilayer wiring board | Michio Horiuchi | 2002-01-01 |