Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486553 | Semiconductor device with increased connection strength between solder balls and wiring layer | Tomoko Takizawa | 2002-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486553 | Semiconductor device with increased connection strength between solder balls and wiring layer | Tomoko Takizawa | 2002-11-26 |