Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6432746 | Method for manufacturing a chip scale package having slits formed on a substrate | Shin Kim, Hee-Guk Choi, Se-Yong Oh | 2002-08-13 |
SK
Se Ill Kim
Overall (2002): #120,405 of 266,432Top 50%
1
Patents 2002