Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489218 | Singulation method used in leadless packaging process | Hyeongno Kim, Sangbae Park, Junhong LEE, Kun-A Kang, Bae Doo Kim | 2002-12-03 |
| 6355502 | Semiconductor package and method for making the same | Kun-A Kang, J. H. Lee | 2002-03-12 |
| 6342730 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung, Kun-A Kang | 2002-01-29 |